Describe a specific project where you architected or significantly contributed to a high-density compute system using ORv3 (Open Rack v3) or a similar open/modular rack standard. What were the key architectural decisions you made regarding power delivery, thermal management, mechanical integration, and scalability? What trade-offs did you evaluate, and what was the outcome?

High-power-density edge compute (often 30–100+ kW per rack equivalent) requires tight integration between compute architecture and power/thermal systems. Describe a project where you led or drove co-design between compute hardware and power/thermal systems. What specific challenges arose, and how did you resolve them? How did this impact overall system performance or density?

This role requires deploying high-performance compute in shipboard or airborne environments (shock, vibration, EMI, temperature extremes, weight/volume constraints). Describe your experience designing, qualifying, or integrating compute systems for naval, airborne, or similarly demanding platforms. What standards or methods did you use, and what were the biggest technical hurdles you overcame?

Tell us about a time you served as the principal technical authority for a complex compute or data center system. How did you define the overall architecture, make key trade-off decisions, and drive alignment across hardware, power, mechanical, software, and mission teams? What was the measurable impact of your architectural decisions?

Modular edge AI compute requires high-performance interconnects (e.g., PCIe, CXL, Ethernet fabrics, NVLink, or custom fabrics) and optimization for AI workloads at the edge. Describe your experience designing or architecting high-speed interconnect fabrics or accelerator integration in dense compute systems. What considerations drove your choices, and how did you balance performance, power, and reliability?

Bastogne AI is building sovereign, resilient edge AI that must operate in denied or contested environments where traditional data center assumptions do not apply. Why does this specific challenge (modular, rugged, power-dense edge compute for naval and airborne platforms) interest you at a principal architect level? Describe a past project where you had to deliver high performance under severe constraints (power, thermal, size, reliability, or environmental). What approach did you take?